In design, there are instances where it will need to add or delete layers. Request 4 Layer PCB Manufacturing Quote Now Add and D elete I nner L ayer With negative film, you only need to create a THERMAL PAD at the junction of the outer and inner layers, which is very beneficial for design and data transmission. You must lay copper if you use the MID LAYER, also known as the positive layer. Paving copper will make the entire design data volume very large, which is not conducive to data communication and transmission, and will affect the design refresh speed. In the multi-layer PCB board, the ground and power layers generally use the whole piece or several large copper partitions for the circuit. The negative film layer is mostly used as a ground and power layer. The positive layer is generally used for pure track lines, including outer and inner lines. These two layers have different properties and usage methods. The one on the left (SIGNAL LAYER) is the positive layer, including TOP LAYER, BOTTOM LAYER, and MID LAYER. The one in the middle (INTERNAL PLANES) is the negative layer, also called the INTERNAL LAYER. Open a PCB design file and press the shortcut key L, and the layer setting window appears. There are two types of electrical layers in PROTEL99. The L ayer S etting and the D ivision of the I nternal E lectric L ayer of Protel99 Click DESIGN/SPLIT PLANES to view each SPLIT PLANES. ![]() The DIP footprint components and plug-in parts that pass through the top and bottom boards will automatically get away from the PLANE in this area. At this time, the via holes in this area are automatically connected to the corresponding copper in the same layer. The two pieces are automatically separated according to the SPLIT2 border (SPLIT1 is distributed on the periphery of SPLIT). Pay attention to the pads or vias of SPLIT1 when overlapping don’t try to connect SPLIT1 to the area of SPLIT2. Suppose SPLIT1 and SPLIT2 overlap in the same PLANE (SPLIT2 is inside SPLIT1). Please note that different network surface layers in the same PLANE should not overlap if possible. To delimit the power or ground plane (mainly for the convenience of the PLACE/SPLIT PLANE command later), use PLACE/SPLIT PLANE to delimit the area in the corresponding areas of INTERNAL PLANE1 and INTERNAL PLANE2. VCC2 copper and GND2 copper should not be in the same PLANE as VCC. If there are multiple power sources such as VCC2 or GND2, first use a thicker wire in PLANE1 or PLANE2 or FILL. At this time, the wire or the corresponding copper ground is not visible, and the wire or filling can be clearly seen against the light. PLANE1 and PLANE2 are two layers of copper connecting the power supply VCC and the ground GND. This will increase MIDPLAYER, which is mainly used for multi-layer signal line placement. Please note: you should not use ADD LAYER. ![]() The middle layer first uses the command DESIGN/LAYER STACK MANAGER to add INTERNAL PLANE1 and INTERNAL PLANE2 with ADD PLANE as the most used power layers such as VCC and ground layers such as GND that is, connect the corresponding network labels. The top and bottom layers are lay out with signal lines. Generally speaking, 4 layer circuit board includes the top layer, bottom layer, and two middle layers. Soler Mask: Green Yellon White Black or customĪccept 4 layer PCB with Blind or buried holeġ00% Testing How to Design a 4 Layer PCB Board 1. Surface Process: Immersion gold , HASL-LF,Hard Gold, Immersion Tin Min Hole: 0.15mm by mechanical drilling 0.1mm by laser Provide free DFM Checking, We can suggest 4 layer PCB stack-upĬopper Thickness: Max to 6 oz inner copper, 12 oz outer copper Request 4 Layer PCB Quote Now 4 Layer PCB Capability :
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